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Factors Affect The Engraving Depth of Laser Marking Machine
Fiber laser marking machine is one of the most widely used materials, and it is also the most stable type for marking on metal materials in recent years. With the update and iteration of laser manufacturers, the laser marking machine has been innovated always, from 10 watts to 20 watts to 30 watts and 50 watts.
Stainless steel is more difficult to deepen marking. We generally use high-speed and high-power for engraving. Usually, the marking depth is only 1mm within 5 minutes;
Carbon steel and stainless steel marking parameters are similar;
Aluminum is a relatively soft material, generally the normal parameters are sufficient, the depth is 1-2mm.
The laser marking machine has two important technical indicators in the application of products: marking depth and marking area.
Today, I will discuss with you how to adjust the laser marking depth.
1.Increasing the power of the laser: Everyone knows that the laser is the core component of the laser marking machine. As the quality of the laser is improved, the laser beam will inevitably be improved to provide the workload of the laser marking machine, but it will often increase the overall machine cost. Once the laser is upgraded, its corresponding supporting devices must be upgraded, which will increase the cost of the whole machine.
2.Turn the field lens of the laser marking machine into a small-range field lens: after changing the field lens, the marking depth will be deeper. For example, the previous semiconductor laser marking machine can match the field lens of 110. With a field lens of 50, the total laser energy and lettering depth will reach approximately twice the previous effect. The same applies to the popular fiber laser marking machines.
3.Improve the beam quality: to improve the beam quality, you need to adjust the inside of the laser cavity, replace the light guide material or replace the pump source, or upgrade the laser total mirror and output mirror. If it is a semiconductor laser marking machine, add small holes to increase the cooling accuracy, adjust the laser mode to emit light, make the laser large, round and bright. In short, it is to modify the laser cavity to improve its configuration. It is necessary to have a sufficient understanding of the structure and configuration of the laser marking machine, otherwise it will directly affect the laser marking equipment.
4.Slow down the marking speed of the laser marking machine: under the same power and the same other parameters, just modify the marking speed, and the marking depth will of course be deeper. That is to say, the speed of the marking machine slows down, the power increases, and the marking becomes deeper.
5.Replace high-quality laser marking accessories: use a high-quality laser set to process the spot. It is a good way to use a beam expander, so that the focus of the laser will be strong and the spot effect obtained will be more ideal. For example, if a semiconductor laser marking machine uses an imported Q switch, its marking depth will be better.
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